Bulk Data Entry Defines properties for solder fatigue
analysis.
Format
(1) |
(2) |
(3) |
(4) |
(5) |
(6) |
(7) |
(8) |
(9) |
(10) |
PFATSDR |
ID |
C4GAMMA |
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Definition
Field |
Contents |
SI Unit Example |
ID |
Entry identification
number. Each PFATSDR entry must have a
unique ID. This is referenced by the FATDEF Subcase Information
entry.
No default (Integer > 0)
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|
C4GAMMA |
Empirical model constraint
for solder fatigue. No default (Real > 0)
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Comments
- C4GAMMA is used to calculate the Strain range of the
solder joint:
Where,
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- Component length.
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- Coefficient of thermal expansion (CTE).
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- Solder joint height.
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- Difference between thermal expansion coefficients of the PCB and
the component soldered onto the board.
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- Input temperature.
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- Difference between temperatures of the PCB and the component
soldered onto the board.
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- Empirical model constant for solder fatigue (specified using the
C4GAMMA field). It is equal to
for leadless joint type. For BGA
type, you can define the empirical model constant.