FATSDR

Bulk Data Entry Defines the solder joint for consideration in solder fatigue analysis.

Format

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
FATSDR ID SDRTYP SIDPKG SIDPCB          
  DIM PKGLEN SDRTHK            
  SOLDER SDR1 SDR2 etc etc etc      

Definitions

Field Contents SI Unit Example
ID Entry identification number.

Each FATSDR entry must have a unique ID. The FATDEF Subcase Information entry may reference this ID.

No default (Integer > 0)

  
SDRTYP Defines solder joint type.
XLEAD
Leadless solder joint.
BGA
Ball Grid Array solder joint.

No default

  
SIDPKG Element SET identification number of the component.

No default (Integer > 0)

  
SIDPCB Element SET identification number of the PCB.

No default (Integer > 0)

  
DIM Optional continuation line indicating the dimension information follows.  
PKGLEN Component length.
Blank (Default)
Real
  
PKGTHK Solder thickness.
Blank (Default)
Real
  
SOLDER Continuation line indicating the solder SETs follow.  
SDRi Element SET of solder "i."

No default (Integer > 0)

  

Comments

  1. For SDRTYP=XLEAD, two SDRi are expected. Otherwise, an error is issued during the run.
  2. Fatigue load should be a static load with Thermal Expansion Coefficient defined.
  3. Load History via the TABFAT entry is not allowed.
  4. If DIM continuation line is not specified, OptiStruct will attempt to measure this from Finite Element Mesh data.