OS-E: 0895 Flat Plate with Thermal Compliance Response
Demonstrates the usage of thermal compliance responses with Topology Optimization in OptiStruct.
Model Description
- Element Type
- CQUAD4, CHBDYE
- Material Properties
- Young's modulus
- 210000 Nmm2
- Poisson's ratio
- 0.30
- Thermal expansion coefficient
- 1.0E-05 K-1
- Thermal conductivity
- 401.0 W mm-1 K-1
- Free convection heat transfer coefficient
- 25.0 W mm-2 K-1
Optimization Formulation
- Objective
- Minimize thermal compliance (TCOMP)
- Constraint
- Volume fraction (VOLFRAC) ≤ 0.3
Results
Model Files
The model file used in this example includes:
<install_directory>/hwsolvers/demos/optistruct/examples/plate_therm_comp.fem